Who we Are

We are a young company founded as a spin-off from University of Heidelberg in 2011. EXTOLL is a privately held company that delivers cutting-edge products to the high-performance interconnect IP market. Initially active only in the high-performance computing market (specifically networks for HPC), EXTOLL moved on to become a semiconductor IP company which already has early market success in communication, Space, Industrial and the automotive areas. 

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About us



Latest news

Nov 16, 2021 | Company  

EXTOLL GmbH appoints Semiconductor Veteran Dirk Wieberneit as new CEO

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EXTOLL GmbH, the provider of cutting-edge interconnect technology and IP, is pleased to announce Dirk Wieberneit as its new Chief Executive Officer, effective November 1, 2021. Mr. Wieberneit has spent more than 25 years in the semiconductor industry, led global engineering teams and has a proven track record in growing a fabless chip maker business. In his most recent role Mr. Wieberneit was the General Manager of Intel’s Connected Home Gateway Business Line. “We are very happy to have Dirk joining our management team.” said Dr. Ulrich Krackhardt, COO/CFO and Co-Founder of the company. “With his management experience in building organizations and running a semiconductor business, Dirk will be instrumental for us to lead EXTOLL into the next development stage and company growth ahead of us.” “I am more than excited to join EXTOLL at this moment in time!” replied Mr. Wieberneit. “EXTOLL’s SERDES solution is proven in various advanced foundry nodes and faces an increasing market demand. First steps are made to expand EXTOLL’s interconnect portfolio further, and I am thrilled to be part now of EXTOLL’s journey to become a leading supplier of interconnect solutions for the high-performing System-on-Chip market.”  

Nov 3, 2021 | Company  

EXTOLL GmbH expands Engineering Capabilities with new Design Center in Thessaloniki, Greece

EXTOLL GmbH, headquartered in Mannheim, Germany, is expanding its team of Analog/Mixed-Signal experts by opening-up a new Design Center in Thessaloniki, Greece. The team will help to fulfill EXTOLL’s mission on delivering cutting-edge Serializer-Deserializer (SerDes) IP and leading interconnect technology to be integrated in next generation System-on-Chips and leading-edge foundry nodes. “We are thrilled to expand our team in Greece and excited to find the best talents, both on an experienced level as well as on graduate level.” said Dr. Mondrian Nüssle, Managing Director and CTO of the company. “Thessaloniki has an impressive environment and source of talents for high-tech companies supported by the Aristotle University.”  

Sep 23, 2021 | Company  

First generation NoC from EXTOLL empowers EPI EPAC1.0 Test Chip

EXTOLL GmbH, headquartered in Mannheim, Germany, an IP provider for leading-edge interconnect technology, implemented the very high-speed Network-on-Chip and SERDES functionality which is now available in the first test chip EPAC1.0 of the European Processor Accelerator program, which is a part of the European Processor Initiative (EPI). As a Germany based company, EXTOLL is participating in EPI as one of 28 partners from 10 European countries. “We are very excited to see our novel Network-on-Chip technology working first-time-right in the EPAC1.0 test chip.” said Dr. Ulrich Krackhardt, Managing Director and COO/CFO of the company. “Combined with our well-known SERDES technology, this NoC implementation is another important step on our journey to expand our product portfolio of advanced interconnect solutions.” 

 Please find the press release of the European Processor Initiative accordingly: https://www.european-processor-initiative.eu/epi-epac1-0-risc-v-test-chip-samples-delivered/