News and Press Archive 2013
November 17–22nd, 2013
Supercomputing Conference (SC13) in Denver, CO.
At Booth#3828 EXTOLL GmbH presents the brand-new results of research and development.
The Exhibitor Forum Talk on Thursday November 21st "A Scalable Interconnect Targeted to FPGAs and ASICs" will reveal some great news! Please don't miss to join us there!
August 20th, 2013
EXTOLL announces sponsoring of ParCo2013:
EXTOLL GmbH is proud to announce that it is an industry sponsor of this years ParCo conference taking place at
Leibniz Rechenzentrum (LRZ) in Munich, 10–13 September 2013. [...] read more
July 31st, 2013
EXTOLL proudly announces the tape out of the TOURMALET ASIC. The chip is
currently in production and is expected to be available by end of 2013.
May 22nd, 2013
Prof. Thomas Lippert wrote about the DEEP project on the ISC HPC Blog. EXTOLL is the interconnect solution used for the booster part of the DEEP architecture. [...] read more
March 25th, 2013
The well known HPC blog insideHPC.com brought an interview with EXTOLL's Mondrian Nuessle. [...] read more
March 19th, 2013
On March 15th Norbert Eicker from Juelich Supercomputing Center (JSC) gave a talk on the DEEP project at the HPC Advisory Council Switzerland Conference 2013 in Lugano.. [...] read more